PCB Assembly

Our PCB Assembly (PCBA) Process

Puruidy utilizes dedicated SMT production lines and advanced equipment to provide high-quality, small-to-medium volume manufacturing services for custom PCB products.

01. IQC Incoming Quality Control

Puruidy thoroughly inspects all incoming materials and resolves quality issues prior to SMT assembly.
- Verifying resistance and capacitance values.
- Checking component and board pad consistency.
- Confirming incoming material quantities.
- Inspecting for component abnormalities.

02. Solder Paste Printing

This is a key step in the SMT PCBA process. Using a stencil printer—the most common method—solder paste is accurately applied to the PCB pads, depositing the precise amount and thickness required.

03. Solder Paste Inspection (SPI)

Puruidy utilizes SPI to perform online inspection for defective solder paste printing during assembly. This process directly checks solder paste quality on the PCB, effectively reducing the defect rate and saving significant time and cost.

04. SMD Component Placement

This is the PCBA process where surface-mount components are accurately placed onto the designated pads of a PCB, establishing the foundational electrical interconnections.

05. Reflow Soldering

In this process, components are initially held in place by solder paste. The assembled PCB then passes through a precisely controlled heating cycle in a reflow oven, melting the solder to form permanent, reliable electrical and mechanical bonds.

06. Automated Optical Inspection (AOI)

Puruidy employs AOI to perform comprehensive post-reflow soldering inspection. It accurately detects a range of defects—including misalignment, insufficient solder, bridging, and missing components—ensuring the highest quality and reliability of every PCBA.

07. Through-Hole Component Soldering

This critical step completes the assembly of through-hole components. Puruidy offers two precise methods: flexible manual soldering​ for prototypes and small batches, and high-efficiency wave soldering​ for mass production, ensuring reliability for every design.

08. First Sample Test

Puruidy performs a final verification on completed assemblies. Using the design files (Gerber, BOM, and coordinates), a first-article tester validates the resistance and capacitance values to ensure all parameters are correct.

09. X-Ray Inspection

V employs X-ray inspection to verify the quality of hidden solder joints, particularly for components like QFN and BGA packages. This non-destructive process ensures the reliability of every individual solder ball, guaranteeing the integrity of the final assembly.

10. Final Inspection and Functional Test

In the final stage, Puruidy conducts functional testing to verify the assembled PCB performs as expected. Depending on the application, specialized tests—such as drop tests for automotive or halogen tests for medical devices—are also performed.

Our PCB Assembly (PCBA) Process

Puruidy utilizes dedicated SMT production lines and advanced equipment to provide high-quality, small-to-medium volume manufacturing services for custom PCB products.

PCB Fabrication

Puruidy provides a One-Stop Solution for PCB & Prototype Assembly, specializing in prototype and small-batch production. We deliver high-tech, cost-effective multilayer PCBs with up to 14 layers, including specialized boards such as Impedance Control PCBs, and PCBs with Buried & Blind Vias.

  • PCBs with up to 14 layers
  • Min hole size:0.2mm
  • Laser Direct Imaging (LDI)
  • Half-cut/Castellated Holes
  • Blind,Buried and Plugged Vias
  • Via in pad
  • Z-axis milling
  • 100% Electrical Testing
  • High Density Interconnect PCBs
  • Special colors & -lacquers
  • Edge Plating
  • Custom Stackup
  • Via filled with resin
  • Min track/spacing 0.1mm/4mil
  • High-Temp,FR4,Flex,HDI,Rogers,etc
  • Lead-Free compliant PCBs
  • Impedance control
  • Carbon ink
  • Countersink/Counterbore

PCB Assembly

Puruidy provides turnkey PCB assembly services, from prototype to low and medium-volume production runs. We manage the entire process for you, including component procurement, manufacturing, assembly, testing, and final delivery. Our capabilities extend to assembling advanced components such as BGA, Micro-BGA, and QFN packages.

  • PCB Assembly Process
  • Through-Hole Assembly
  • Special Reminders
  • BGA X-Ray Inspection
  • SMT Assembly Capabilities
  • Mixed Assembly Advantages
  • File Requirements
  • Automated Optical Inspection
  • BGA Assembly Capabilities
  • PCB Assembly Capability

Parts Management & Component Sourcing

Puruidy provides comprehensive component sourcing to support our assembly services. Our extensive industry experience has enabled us to build strong partnerships with authorized distributors such as Digi-Key, Mouser, Arrow, and Avnet, ensuring reliable access to your required components at competitive prices.

  • Kitted and Turn-Key PCB Assembly
  • Part Crosses and Substitutions
  • Modules IC Programming
  • Lowest Surcharge Rate
  • Component Inventory Management
  • Unique Global IC Sources
  • Electrical Characteristic Analysis
  • Sourcing Rare Component
  • Parts Incoming Check
  • Quick BOM Pricing in 24 hours

Functional Testing and Other Testing

Puruidy provides comprehensive PCB assembly testing services, including In-Circuit Testing (ICT), Functional Testing (FCT), Aging Testing, and environmental tests such as Temperature & Humidity and Drop Testing. We execute tests per customer plans and deliver summarized data reports.

Advanced Testing Equipment:

Our lab is equipped with environmental chambers (high/low temperature, salt spray, dust, UV), mechanical testers (drop, shock, vibration, button durability), and precision analyzers (RDS signal generators, high-frequency oscilloscopes, audio analyzers) to ensure product reliability.

Industrial Monitoring & Visual Management:

Our real-time monitoring system tracks the entire SMT production line via 2D/3D visualization. It displays key equipment data—such as placement machine pickup counts, SPI pass rates, and AOI defect detection—enabling immediate process verification and control. Line yield is tracked hourly; if it falls below target, alerts prompt management intervention. By integrating IoT, big data, and automation, we create a closed-loop, self-optimizing production environment where any non-standard operation triggers an immediate alarm.

  • Visual Inspection after SMD Process
  • Functional Testing (FCT)
  • Digital Multimeters
  • Adjustable DC Power Supply
  • LRC Multi-meter
  • Temperature and Humidity Testing
  • AOI Testing
  • Embedded System Testing
  • Input/Output PCBs
  • Digital Oscilloscope
  • Universal Programmer
  • X-ray Testing for BGA Package
  • Testing Software
  • Communication Ports
  • Signal Generator
  • High and LOW Temperature Testing

Other Testing and Customized Services:

  • In-Circuit Testing (ICT)
  • Drop Testing
  • Potting
  • IC Programming
  • High Voltage Testing
  • Box Build Assembly
  • Salt Spray Testing
  • Aging Testing
  • Package Box

IC Programming

Puruidy provides quick-turn chip programming before assembly. We support a wide range of package types (DIP, SOP, QFP, QFN, BGA, etc.).

We prioritize the security of your Intellectual Property (IP) and are ready to sign an NDA upon request. All programming is managed through our qualified production system.

Production Management and Inspection

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